Contents of this Book
- Analytical Mechanics of Solids
- Materials Science for the Experimental Mechanist
- Polymers and Viscoelasticity
- Composite Materials
- Fracture Mechanics
- Active Materials
- Biological Soft Tissues
- Ionic Polymer-Metal Composites
- MEMS and NEMS
- Hybrid Methods
- Statistical Analysis of Experimental Data
- Electrical Resistance Strain Gages
- Extensometers
- Fiber Strain Gages
- Residual Stress Measurement
- Nanoindentation
- Atomic Force Microscopy
- Basics of Optics
- Image Analysis and Processing
- Digital Image Correlation
- Geometric Moiré
- Moiré Interferometry
- Speckle Methods
- Holography
- Photoelasticity
- Thermoelastic Stress Analysis
- Photoacoustic Characterization of Materials
- X-Ray Stress Analysis
- Preliminaries
704
- Polarization
704
- Birefringence
704
- Retardation Plates
705
- Transmission Photoelasticity
705
- Physical Principles
705
- Stress-Optic Law
706
- Fringe Contours in a Plane Polariscope
706
- Jones Calculus
707
- Ordering Of isoclinics
708
- Ordering Of Isochromatics
709
- Calibartion Of Model Materials
709
- Variants Of Photoelastcity
710
- Three-DImensional Photoelasticity
710
- Dynamics Photoelasticity
714
- Reflection Photoelasticiy
715
- Photo-orthotropic Elasticity
717
- Photoplasticity
718
- Digital Photoelasticity
719
- Fringe Multiplication and Fringe Thinning
719
- Phase Shifting in Photoelasticity
720
- Ambigutiy in Phasemaps
723
- Evaluation of Isoclinics
725
- Unwrapping Methodologies
727
- Color Image Processing Techniques
729
- Digital Polariscopes
730
- Fusion of Digtial Photoelasticity Rapid Prototyping and Finite Element Analysis
732
- Interpretation of Photoelasticity Results
734
- Stress Separation Techniques
735
- Shear Difference Techniques
735
- Three-Dimensional Photoelasticity
736
- Reflection Photoelasticity
736
- Closure
737
- Optical Methods
- Mechanical Testing at the Micro/Nano Scale
- Biological Tissue Testing
- Biomedical Devices and Biologically Inspired Materials
- High Strain Rate and Impact Testing
- Delamination Mechanics
- Structural Testing Applications
- Electronic Packaging